Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Taking advantage of DDR5's low power consumption, PNY's latest SODIMM kits run at just 1.1 volts. On-die ECC support further ...

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Explore the NVIDIA GeForce RTX 5090: unmatched power, advanced cooling, and next-gen connectivity for gamers and ...

Micron stock surges after Nvidia CEO praises their chips at CES. But mixed technical signals may impact the rally.

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Remote patient monitoring has emerged as a cornerstone of modern healthcare, particularly with the growing need for ...

South Korea's memory sector faces a slump in the generic memory market due to weakening demand in smartphones and PCs, ...

According to market research firm TrendForce on the 1st, DRAM prices are expected to fall by 8 to 13% and NAND prices by ...