Arm’s Chiplet System Architecture, which addresses key chip design challenges, builds on the Neoverse Compute Subsystem and AMBA.

High-density heat is the new bottleneck. Which liquid cooling and heat rejection strategies are best equipped to handle it?

Efficient Computer’s Electron E1 general-purpose processor claims up to 100× higher energy efficiency than general-purpose CPUs.

Intermediate bus converters address key concerns such as efficiency, power loss, thermal dissipation, and size in data centers.

Generative AI is arguably the most complex application that humankind has ever created, and the math behind it is incredibly ...

Over the past two and a half years, Ukrainian long-range drones have been targeting Russian warehouses and radar positions ...

The audio component centers around the SS8550 PNP transistor (Q1) which serves as a driver for the passive buzzer (BZ1). This ...

Japanese operator is testing the potential of quantum computing to improve radio access network (RAN) performanceSoftBank says a Tokyo proof of concept shows ...

HelixML's new 2.0 release ensures customers are shipping secure, compliant AI Agents to production in just 8 weeks HelixML today announced Helix 2.0, a next-generation private AI platform designed ...

Colchester residents express concerns over proposed inn in Malletts Bay, citing potential traffic, environmental impacts, and ...

Alumina (Al₂O₃) ceramics represent a crucial category of advanced structural engineering materials due to their excellent ...

Key developments of interest over the last month include: the UK government's communications in connection with the Chancellor's annual Mansion ...