Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap ...

Such defects can lead to shorts, interference between neighboring memory strings, and other performance issues.” [4]. Stacking several decks of memory arrays (e.g. 2 decks of 64-layers to provide an ...

Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

Neo Semiconductor is located in San Jose, California. 3D stacking of silicon has been around for a few years. You’ve probably seen it in AMD’s latest Ryzen CPUs with 3D V-Cache technology, however, ...

A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...

You may like AI GPU accelerators with 6TB HBM memory could appear by 2035 as AI GPU die sizes set to shrink - but there's far worse coming up 3D X-DRAM technology will bring bigger, faster memory ...

In a development that the company claims could meet a future demand for higher density NAND flash memory, at the VLSI Symposium in Japan today Toshiba Corp. announced a new three-dimensional memory ...

The new 3D flash memory technology is the eighth-generation BiCS FLASH, which reportedly has the industry's highest bit density owing to its 218-layer 3D flash that leverages 1Tb triple-level-cell ...