Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap ...

Such defects can lead to shorts, interference between neighboring memory strings, and other performance issues.” [4]. Stacking several decks of memory arrays (e.g. 2 decks of 64-layers to provide an ...

In order to achieve cost-effective giga-byte storage with improved reliability and performance, this paper introduces Crossed BL (CBL) architecture (CBLA) in 3D Flash memory with CMOS directly bonded ...

Neo Semiconductor is located in San Jose, California. 3D stacking of silicon has been around for a few years. You’ve probably seen it in AMD’s latest Ryzen CPUs with 3D V-Cache technology, however, ...

In a development that the company claims could meet a future demand for higher density NAND flash memory, at the VLSI Symposium in Japan today Toshiba Corp. announced a new three-dimensional memory ...

A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...

Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

The new 3D flash memory technology is the eighth-generation BiCS FLASH, which reportedly has the industry's highest bit density owing to its 218-layer 3D flash that leverages 1Tb triple-level-cell ...