Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap ...

Such defects can lead to shorts, interference between neighboring memory strings, and other performance issues.” [4]. Stacking several decks of memory arrays (e.g. 2 decks of 64-layers to provide an ...

Abstract “Conventional resistive crossbar array for in-memory computing suffers from high static current/power, serious IR drop, and sneak paths. In contrast, the “capacitive” crossbar array that ...

This sixth-generation 3D flash memory features advanced architecture beyond conventional eight-stagger memory hole array and achieves up to 10% greater lateral cell array density compared to the ...

In a development that the company claims could meet a future demand for higher density NAND flash memory, at the VLSI Symposium in Japan today Toshiba Corp. announced a new three-dimensional memory ...

Intel and Micron emphasized that in terms of data, time is not necessarily on our side, thus driving the need for 3D XPoint. By 2020, we’re going to generate another 44 Zettabytes of data. A ...

The new 3D flash memory technology is the eighth-generation BiCS FLASH, which reportedly has the industry's highest bit density owing to its 218-layer 3D flash that leverages 1Tb triple-level-cell ...

Kioxia Corporation and Western Digital Corp., today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the ...

Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.