The effects of contact resistance induced by bonding interface roughness and bonding pressure on electromigration (EM) evolution in Cu–Cu bonding interconnects are investigated through Multiphysics ...

This paper presents a brief review of continuous-time, low-power integrated CMOS analog front-ends (AFEs) for capacitive transducers, such as MEMS microphones. Source follower (SF), common source (CS) ...

GISTEL, BELGIUM – June 25, 2025 – Sofics bv, a world leading solution provider specializing in physical layout and design, with a focus on the built-in robustness of integrated circuits that demand ...