TechInsights today released early-stage findings of its teardown analysis of the NVIDIA Blackwell HGX B200 platform delivering advanced artificial intelligence (AI) and high-performance computing (HPC ...

Back before there were AI factories, there were two generations of the AI Bridging Cloud Infrastructure supercomputer, built ...

Two years after introducing the Ryzen 7045 “Dragon Range” line of mobile chips for gaming laptops AMD is back with four new ...

The multivendor UALink Consortium has defined its first low-latency, accelerator‐to‐accelerator communication specification, ...