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Tech Xplore on MSNCost effective method developed for co-packaging photonic and electronic chipsThe future of digital computing and communications will involve both electronics—manipulating data with electricity—and ...
The development of a semiconductor system is more complex than just describing functionality in RTL. How ready are AI models ...
Swift Engineering used HyperX software to remove 100 pounds from 38-foot graphite/epoxy cored nose cone for X-59 supersonic ...
Simulation-led design eliminates guesswork, optimizing everything from production to communication while achieving equal or ...
Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...
Modern Engineering Marvels on MSN2h
The Elegant Math That Could Quietly Revolutionize Wind Turbine DesignWhat if one mathematical nuance has been quietly restraining the efficiency of wind turbines since the turn of last century?
3don MSNOpinion
NASA was a mere passenger. Musk has crowded low Earth orbit with satellites (nearly 8,000) that are becoming indispensable to ...
To mark the launch of our 2025 AI survey, the AJ takes a look back at our recent coverage of how AI tools are being used and viewed across the industry ...
RIT’s PhoenixDFR tool helps engineers design products for remanufacturing, advancing circular economy goals from the start.
Ansys SimAI is a physics-agnostic and cloud-enabled computer-aided engineering tool that predicts performance of complex ...
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