The development of a semiconductor system is more complex than just describing functionality in RTL. How ready are AI models ...

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...

Professor David Meyer (CivMin) and CivMin PhD student Omar Abdelazeem synthesized best practices to create the SWMMIN model ...

Background The evidence on associations between ultra-processed foods (UPF) and lung cancer risk is limited and inconsistent.