Taiwan Semiconductor Manufacturing Co (TSMC) is on the brink of finalizing specifications for an innovative chip packaging method designed to bolster the performance of high-power AI chips, according ...

Nvidia has commissioned one million square feet of high-end production space at factories belonging to TSMC, Foxconn, and Wistron in Arizona and Texas.

Taiwan Semiconductor (TSM) is nearing the rollout of an advanced chip packaging mechanism to power Nvidia (NVDA) and Alphabet (GOOGL) Google’s ...

Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s leading contract chipmaker, is nearing completion of a cutting-edge chip packaging technology to meet surging demand for high-performance AI ...

Pillow pack packaging refers to a type of flexible packaging that takes on the shape of a pillow or cushion when sealed. It typically consists of lightweight materials such as polyethylene, ...

Beyond that the phone would have new camera sensors as well as a bigger battery working in tandem with the new and improved - Details Below ...

NVIDIA is among the first ones to move the production of products to US shores, specifically in Arizona and Texas.

Blackwell production already underway in Arizona with server manufacturing coming to Texas within 15 months Nvidia wants to build and sell up to half a trillion US dollars of American-made AI ...

Nvidia said on Monday that it “plans to produce up to a half trillion dollars of AI infrastructure” in the U.S. within the ...

"Nvidia Blackwell chips have started production at TSMC’s chip plants in Phoenix, Arizona," the company said in today's ...

Nvidia said it is working with its manufacturing partners to build factories that will produce AI supercomputers in the U.S.

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” was published by researchers at University of Illinois, Urbana, University ...