KAGA FEI Co., Ltd., a global provider of leading short-distance wireless modules, today announced the expansion of its ...

Tweet this The RX23W MCU incorporated in the new module supports full Bluetooth 5.0 Low Energy communication support including long-range and 2 Mbps data throughput.

A Bluetooth LE 5.4 module, the HCM511S from Quectel, leverages the power of an Arm Cortex-M33 core, along with 352 or 512 kbytes of flash memory. The module, which also provides 32 kbytes of RAM, ...

Quectel’s FCM360W module is offered in the LCC form factor with an ultra-compact package size of 25.5mm x 18.0mm x 3.2mm, providing great flexibility for developers.