What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Dr. Fatma Kocer, VP Engineering Data Science at Altair, says GDL and other techniques will unleash foundational models akin ...

Product Engineering Services (PES) providers deliver comprehensive support throughout the entire product lifecycle—from ...

The whitepaper represents the first-ever analysis of the impact of stochastics effects from the perspective of resolution. A gap has emerged between the size of features that can be patterned in ...

Currency risk is limited as most transactions are made in USD. Intellectual property theft is a major risk. The most high-profile incident was TSMC’s settlement with SMIC, in which the firm received ...

TSMC’s 3nm process is a game-changer, especially for AI and high-performance computing (HPC). It’s not just about shrinking ...

Discover how Sarvesh Kumar Gupta's innovative distributed database pipeline transformed financial data processing, maximising ...

This was a high-stakes implementation of advanced data pipelines designed with zero tolerance for data inconsistency or ...

What are the largest shapes in the Universe? The answer might be found in the most unassuming places here on Earth ...

New alloy Ni₄W enables field-free magnetization, promising faster, energy-efficient memory tech for AI, electronics, and HPC systems.

Understand how zonal architecture is reshaping the automotive industry for software-defined vehicles and advanced automation.

The Snapdragon 8s Gen 4 (model SM8735) is a deliberate and strategic tiering of Qualcomm’s 8-series portfolio. Fabricated on TSMC’s 4nm process node, it inherits key architectural elements from its ...