Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...

The demand for transporting technically sophisticated cargo such as aircraft engines, semiconductor machinery, super-heavy freight, and vehicles has surged.

Researchers grow single-crystal GaN films on amorphous glass using a chemically converted molybdenum nitride buffer, removing ...