Wire bonding (WB) have been widely used in 3D stacked integrated microelectronic packaging because of its high reliability and low-cost. In 3D stacked packaging, the required size for microelectronic ...

Pavement cracks are considered to be the main indicator of pavement performance. Because traditional artificial detection is dangerous, time-consuming, people have developed high-speed road image ...

A pytorch implementation of 3D UNet for 3D MRI Segmentation. - GitHub - amir-aghdam/3D-UNet: A pytorch implementation of 3D UNet for 3D MRI Segmentation.

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