Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...

Laura Evans [email protected] +1.856.727.1100 x 5012 OPEX® Corporation, a global leader in Next Generation Automation providing innovative solutions for warehouse, document and mail automation, is ...

Delhi High Court ruled that untimely deficiency memos do not justify refusing full interest on delayed GST ITC refunds, providing a detailed interest calculation ...

This article proposes a new algorithm based on coefficient compression, which can be used for the design and implementation of various FIR filters, to address the proble ...

To mark the launch of our 2025 AI survey, the AJ takes a look back at our recent coverage of how AI tools are being used and viewed across the industry ...