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Semiconductor Engineering2d

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...
Floodlight (English) on MSN4d

‘Farming in the dark’: Brooke Rollins’ leadership, DOGE’s grip and the cost to American agriculture

Six months into her tenure, Brooke Rollins has reduced USDA staff, sidelined science, shifted agency culture, and expanded ...