The companies noted that they will jointly develop the second generation 3D XPoint technology by first-half of 2019 at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, UT.

Semiconductor manufacturers Intel and Micron are working on a new type of non-volatile computer memory that they say is up to 1000 times faster and more durable than NAND flash. 3D XPoint (pronounced ...

Unlike NAND, 3D Xpoint memory can also write data into much smaller areas. NAND flash must be written in relatively large blocks (we covered this in our recent explainer on SSDs and NAND technology).

As the digital world’s data footprint balloons – from 4.4 zettabytes of digital data created in 2013 to an expected 44 zettabytes by 2020, according to Intel – 3D XPoint technology will be ...

However, on the company's Oct. 25 earnings call, Intel interim CEO and CFO Bob Swan updated that outlook, stating that, "as a result of pursuing 3D XPoint development independently and a tougher ...

That’s one way to differentiate Micron’s 3D Xpoint products from Intel products, which will be branded Optane. Initially, Micron is looking at 200GB to 1.4TB SSDs that could be plugged into ...

The SSD is capable of 550 000 read input/output operations per second (IOPS) and 500 000 write IOPS according to Intel. The drive is also rather resilient as it will be used in data centers which ...

Summary Some think Intel will double sales and profits in the next 5 years. To get a double, sales of 3D NAND and 3D XPoint must be huge. Micron as 50/50 partner in 3D NAND and 3DX will grow much ...

That's estimated to happen between mid-2020 and early 2021 depending on when the deal finalizes, and Micron has plans to introduce its own competing products based on 3D XPoint as well as new ...

The press release describes 3D XPoint as “a three-dimensional checkerboard where memory cells sit at the intersection of word lines and bit lines.” Each individually addressable memory cell can store ...