As the preceding process of chip-to-wafer (C2W) hybrid bonding, die pick-up, and transfer are critical in 3D heterogeneous integration (3D HI) technique. Especially, with the ever-shrinking die ...

This week Flow Science released a new version of FLOW-3D Cast, its software specially-designed for metal casters. FLOW-3D Cast v4.1 offers powerful advances in modeling capabilities, accuracy and ...

Wire Sweep Optimization with Mold Process Simulation (Virtual DoE) Abstract: Wire sweep is a major concern to molders as the resin flow around the wires could induce potentially high wire deformations ...