IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

John Courtney, Product Development Engineer, and Micheal McGuirk, Senior Manager, Product Development Engineering at AMD, ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

The application of artificial intelligence (AI) has emerged as a driving force behind global technological innovation. As AI ...

This university program will offer professors, researchers, and students access to a broad collection of pre-developed ...

Still, the elephant in the room is not the non-core assets but whether Intel will remain whole or split up its CPU and ...

Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver ...

As the cost of mask is increasing and the performance gap between FPGA and ASIC is reducing the FPGA is evolving a strong platform for not-only prototyping but also as a platform for real time design.

March 20, 2025-- TrendForce reveals that the combined revenue of the world’s top 10 IC design houses reached approximately US$249.8 billion in 2024, marking a 49% YoY increase. The booming AI industry ...

A particularly strong first quarter has raised concerns about the probable negative impact on the IC design sector due to demand reversal caused by inventory clearance in the second quarter of 2025.