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Neyhouse applies electrochemical engineering to design scalable processes for cleaner chemical manufacturing and ...
University conducts research to establish conceptual, detailed design methodologies applicable to UAM systems and to develop ...
Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...
Multidrug-resistant bacteria kill five million people each year, with newly resistant germs emerging faster than scientists ...
To mark the launch of our 2025 AI survey, the AJ takes a look back at our recent coverage of how AI tools are being used and viewed across the industry ...
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