News

EDN8h
PCB design tips for EMI and thermal management in 800G systems
Find out PCB design strategies to reduce EMI in 800G systems while maintaining high performance in data center and telecom ...
Semiconductor Engineering8h
CMOS 2.0: Layered Logic For The Post-Nanosheet Era
What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...
Semiconductor Engineering16h
Computer Architecture Extending The Von Neumann Model With A Dedicated Reasoning Unit For Native Artificial General Intelligence(TU Munich, Pace U.)
A new technical paper titled “Augmenting Von Neumann’s Architecture for an Intelligent Future” was published by researchers at TU Munich and Pace University. Abstract “This work presents a novel ...
Electronic Design20h
Source-Down-Packaged MOSFET Fulfills Data Center Power Needs
Alpha and Omega Semiconductor's latest 25-V power MOSFET, which features source-down packaging, helps feed power-hungry GPUs ...