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Semiconductor Engineering2d
Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces
Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...
Filmmaker Magazine4d
LED Walls: Working with the LED Volume for Cinematographers
The Light Stage 3 (2002) was the first physical set to use an array of RGB LED lights surrounding an actor to create an ...