Southeast Asia is attracting record levels of foreign direct investment (FDI), even as global FDI declines. As Courtney ...

The new centre will focus on the development of “state-of-the-art” chiplet, packaging, system integration, sensing, and (edge ...

India], March 26: izmo Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive ...

Understanding chip design as a strategic necessity, the Ministry of Electronics and Information Technology (MeitY), with its ...

UBS analyst Timothy Arcuri says Intel's new CEO Lip-Bu Tan will refocus on chip design in short term, will secure big ...

Programme stands as a flagship initiative under MeitY’s broader strategy to establish India as a semiconductor powerhouse.

The Chips to Startup (C2S) Programme represents a cornerstone of this effort, targeting the development of 85,000 ...

Lightmatter has released two pieces of technology that are aimed at speeding up the connections between AI chips.

solutions to provide a state-of-the-art packaging solution for the photonic chip, covering design, fabrication, and testing. This initiative aligns with India's growing focus on semiconductor and ...

Sarcina Technology's AI platform can create advanced AI packaging solutions tailored to meet customised requirements.

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly working with Nvidia to develop next-generation GPUs utilizing ...

Unprecedented growth and demand for edge computing and high-performance computing (HPC) is creating new opportunities and significant challenges for custom chips. We spoke to Sondrel CEO Oliver Jones ...