These solder balls melt during reflow, and they bond the connections on the underside of the BGA device directly to the PCB pads. BGA internal die connections are routed to the solder balls through ...

2. An LGA array has a grid of contacts that’s connected to a grid of contacts on a PCB. The ball grid array (BGA) is another option to obtain multiple I/O pins (Fig. 3).

The chip comes in an 81-Ball Grid Array at 0.5mm pitch, which meant SparkFun’s usual PCB fabrication methods weren’t going to cut it.

TOPLINE CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (pcbs) and provide more compliancy than solder balls (Ball ...

To enable richer consumer experiences, more IC chipsets with various functionalities and greater memory density have been deployed in the limited phone board area. A new generation of surface mount ...