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The chip comes in an 81-Ball Grid Array at 0.5mm pitch, which meant SparkFun’s usual PCB fabrication methods weren’t going to cut it.
These solder balls melt during reflow, and they bond the connections on the underside of the BGA device directly to the PCB pads. BGA internal die connections are routed to the solder balls through ...
2. An LGA array has a grid of contacts that’s connected to a grid of contacts on a PCB. The ball grid array (BGA) is another option to obtain multiple I/O pins (Fig. 3).
To enable richer consumer experiences, more IC chipsets with various functionalities and greater memory density have been deployed in the limited phone board area. A new generation of surface mount ...
Ron S. Li, Failure Mechanisms of Ball Grid Array Packages Under Vibration and Thermal Loading, SAE Transactions, Vol. 113, Section 5: JOURNAL OF MATERIALS AND MANUFACTURING (2004), pp. 767-772 ...
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