Teledyne’s DDR4 memory module is screened and qualified as an Enhanced Product (EP) for high-reliability aerospace and ...

“With the BGAP520 PCIe NVMe products in Type 1620 BGA package and M.2 2230 module, designers can count on robust and ruggedized Flash memory solutions with unrivalled performance.

Director . Manufacturer of advanced packaging IC substrate. Our advantages: Cost reduction, Capacity supporting. FCBGA/ FCCSP/ CSP/ Sip/ Module/ BGA memory DDR3/DDR4/DDR5/ mmwave PCB substrate etc ...

Comprising a small pc-board with decoupling capacitors on one side and solder balls on the other, the QStack power delivery module attaches directly underneath a BGA package to reduce or eliminate the ...

Renesas Electronics RRM12120 Digital BGA-POP Power Module, available now from Mouser, offers high efficiency in a small form factor for high current applications. The 20A, 12V single-channel digital ...

Staktek is a market-leading provider of intellectual property and services for next-generation module technologies for high-speed, high-capacity systems. Staktek's TSOP and BGA memory stacking ...

Claimed to be the industryÕs smallest and thinnest memory modules, the members of this micro-DIMM product line measure only 1.18" high and have a capacity of 256 MB for both SDR- and DDR-based ...

First, the eMMC memory chip was desoldered. Next, by cleaning of the soldering pads, place for soldering a new memory has been prepared. Then the first attempt was made to solder the eMMC 256GB chip.

BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration ...