Teledyne’s DDR4 memory module is screened and qualified as an Enhanced Product (EP) for high-reliability aerospace and defense systems.

“With the BGAP520 PCIe NVMe products in Type 1620 BGA package and M.2 2230 module, designers can count on robust and ruggedized Flash memory solutions with unrivalled performance.

Claimed to be the industryÕs smallest and thinnest memory modules, the members of this micro-DIMM product line measure only 1.18" high and have a capacity of 256 MB for both SDR- and DDR-based ...

Staktek is a market-leading provider of intellectual property and services for next-generation module technologies for high-speed, high-capacity systems. Staktek's TSOP and BGA memory stacking ...

As memory technology evolves, there is an increasing move towards higher operating frequencies and the use of BGA (ball grid-array) chip packages. This is as true for the DDR/DDR2/DDR3 memory ...

Renesas Electronics RRM12120 Digital BGA-POP Power Module, available now from Mouser, offers high efficiency in a small form factor for high current applications. The 20A, 12V single-channel digital ...

BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration ...