“High aspect ratio (HAR) structures found in three-dimensional nand memory structures have unique process control challenges. The etch used to fabricate channel holes several microns deep with aspect ...

Choi projected that innovative DRAM memory structures, including 3D, 4F2, and VCT ... (High-K Metal Gate) process, which helps reduce leakage current, was only implemented in specific GDDR, DDR, ...

First commercial 3D NAND products were introduced in 2013 with stacks counting 24 word-line layers (128 Gb). Depending on the supplier, variations in the structure exist, known by different names such ...

Fig. 2: New logic structures will require new cleaning solutions. Source: Screen Semiconductor/SEMI. In memory structures, both 3D NAND and deep DRAM capacitors present challenges. In 3D NAND, the ...

Now, researchers have developed a new 3D printing process for the fabrication of 3D metal-plastic composite structures with complex shapes. Skip to main content.

In a paper recently published in the journal Advanced Materials Technologies, researchers established a 3D printing method based on extrusion to produce iron- and steel-based structures having ...

The discoveries could also help scientists working on stem cell therapies, since coaxing a stem cell to become a neuron or heart cell requires shifting it from one genetic program to another — each ...