NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at FMS 2024: the Future of Memory and Storage, taking place ...

Abstract: “High aspect ratio (HAR) structures found in three-dimensional nand memory structures have unique process control challenges. The etch used to fabricate channel holes several microns deep ...

Dr. Choi projected that innovative DRAM memory structures, including 3D, 4F2, and VCT (Vertical Channel Transistor), are expected to enter mass production at the 0C nm node.

Because memory is involved in nearly everything we do, this structure is extremely important to everyday life. Because of its complex role, the hippocampus has connections to, and can “talk ...

Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these ...

Recently, a group of researchers from Japan and Singapore developed a new multimaterial digital light processing 3D printing (MM-DLP3DP) process to fabricate metal-plastic composite structures ...