Fig. 2: New logic structures will require new cleaning solutions. Source: Screen Semiconductor/SEMI. In memory structures, both 3D NAND and deep DRAM capacitors present challenges. In 3D NAND, the ...

“High aspect ratio (HAR) structures found in three-dimensional nand memory structures have unique process control challenges. The etch used to fabricate channel holes several microns deep with aspect ...

Now, researchers have developed a new 3D printing process for the fabrication of 3D metal-plastic composite structures with complex shapes. Skip to main content.

Choi projected that innovative DRAM memory structures, including 3D, 4F2, and VCT ... (High-K Metal Gate) process, which helps reduce leakage current, was only implemented in specific GDDR, DDR, ...

Laser powder bed fusion, a 3D-printing technique, offers potential in the manufacturing industry, particularly when fabricating nickel-titanium shape memory alloys with complex geometries.

NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

There are many ways to 3D print with FDM and SLA printers, leading the current market. This 3D printing system relies on a process known as "two-photon polymerization".

In a paper recently published in the journal Advanced Materials Technologies, researchers established a 3D printing method based on extrusion to produce iron- and steel-based structures having ...