GIGABYTE Launches First Generation Liquid Cooling System : 3D Galaxy series Taipei, Taiwan June 16, 2005 - GIGABYTE TECHNOLOGY, a leading manufacturer of motherboards, VGA cards, PC coolers and ...

The cooling system, expected to be launched on Feb. 6, requires HP's 10000 G2 Universal Rack, a new $1,200 model that replaces seven nonstandard rack models the company used for its products until ...

Liquid cooling is objectively superior, while air cooling would cause the Model 3 to fall short of performance specifications. Implementing an air cooling system could be more expensive.

High-density heat is the new bottleneck. Which liquid cooling and heat rejection strategies are best equipped to handle it?

This particular model was designed to fit on AMD’s Radeon HD 7970, 7950, 7870, 7850, 6970, 6950, 6870, 6850, 6790, 5870, 5850 and 5830 video cards and will use both air and liquid to keep the ...

Three-dimensional (3D) circuits reduce communication delay in multicore SoCs, and enable efficient integration of cores, memories, sensors, and RF devices. However, vertical integration of layers ...

In this paper, we propose a novel online thermal management policy for high-performance 3D systems with liquid cooling. Our proposed controller uses a hierarchical approach with a global controller ...

In the "GLACIER ONE" series, which is Phanteks' first all-in-one water cooling unit, a variation model that embeds a new fan "T30-120" has been introduced.

ZutaCore has launched a liquid cooling system called HyperCool that can handle the forthcoming Nvidia GB200 Grace Blackwell superchip without modifications to the data center or the rack – a ...