TDK is touting their new series of multi-channel power management modules as the world’s first IC embedded power management module for smartphones and tablets. Aimed at reducing lead times and ...

Combining the VCSEL emitter and photodiode in a single 3.3×2.4×1.2-mm package, the Bidos P2433 Q offers one of the smallest VCEL packages on the market for 3D applications at the same power levels and ...

Contacts SolarEdge Yael Eldar +972-54-4419940 [email protected] or fischerAppelt, relations Robert Schwarzenboeck +49-89-74746623 [email protected] www.fischerappelt-relations.de ...

SAN BRUNO, CA-- -Modules comply with type-6 pin-out of current COM Express standard Cost-efficient Intel® Celeron™ variantsMSC Embedded Inc., manufacturer of highly integrated standard board ...

Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on March 29, feature an optimized package structure to reduce switching loss and improve SiC ...

Analog Devices' Erik Barnes shows off a power-efficient, 1-Mpixel, 3D ToF sensor module. 1. The evaluation platform contains a ADTF3175 module 3D time-of-flight sensor. In the video, Erik Barnes ...

“We see a lot of potential in the Eragon 410 system on modules for enabling embedded and IoE products.” The Eragon 410 product line is based on an ultra-small (26mm x 35mm) System-on-Module that acts ...