Fig. 1: AMD’s 3D V-Cache technology stacks the cache on a processor. Source: AMD. Packaging landscape Chiplets are not a packaging type per se. They’re part of a methodology that includes heterogenous ...

The new reverse engineering & costing report, 2.5D & 3D Packaging Comparison 2025, investigates three major components developed by these leading players and especially the 2.5D/3D packaging structure ...

3D-ICs are widely viewed as the way to continue scaling beyond the limits of planar SoCs, and a way to add more heterogeneous devices developed at different process nodes into the same package. But ...

For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US restrictions on ...

One of the first AI chips based on 3.5D packaging is AMD’s latest 3D-stacked accelerator chip, the Instinct MI300A, which is becoming one of the biggest rivals to NVIDIA’s GPU-CPU superchips.

3D Foveros. The other pillar of its advanced packaging arsenal is Foveros, which is used to stack silicon dies on top of each other face-to-face, using tightly-spaced copper bumps to cram more ...

Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and miniaturization needs.

Pacdora 3D modeling software: The Ultimate What-You-See-Is-What-You-Get Experience. As a global leader in online 3D packaging mockups and design, Pacdora is reshaping the packaging design ...

United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond Electronics to ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology. SAN JOSE, Calif.— April 23, 2025 — Cadence (Nasdaq: CDNS) today announced it is ...