Abstract: A 40-Gb/s packaging solution that uses low-cost wire-bonded plastic ball grid array (WB-PBGA) technology is presented. Since such a high speed was beyond the reach of conventional package ...

A high-performance package design was required for a SerDes-to-SerDes Mux chip for backplane applications using eight 1.0-3.125 Gbps lanes on the system side and four 1.0-10.0 Gbps lanes on the ...

Housed in a 255-contact plastic ball-grid-array package that measures just 25 by 25 mm, the W82M32V-XBX multichip memory module provides up to 2 Mwords by 32 bits of asynchronous ...