Such defects can lead to shorts, interference between neighboring memory strings, and other performance issues.” [4]. Stacking several decks of memory arrays (e.g. 2 decks of 64-layers to provide an ...

Flash memory chip maker SanDisk has teamed up with Toshiba to jointly develop and manufacture re-writeable 3D memory, SanDisk revealed in a filing to U.S. stock market regulators on Tuesday. Both ...

In contrast, the “capacitive” crossbar array that harnesses transient current and charge transfer is gaining attention as it 1) only consumes dynamic power, 2) has no DC sneak paths and avoids severe ...

In a development that the company claims could meet a future demand for higher density NAND flash memory, at the VLSI Symposium in Japan today Toshiba Corp. announced a new three-dimensional memory ...

Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

Intel and Micron emphasized that in terms of data, time is not necessarily on our side, thus driving the need for 3D XPoint. By 2020, we’re going to generate another 44 Zettabytes of data.

Western Digital WDC and Kioxia Corporation have jointly introduced their latest 3D flash memory technology using advanced scaling and wafer bonding technologies. This technology is ideal for ...

Kioxia Corporation and Western Digital Corp., today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the ...