News

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...
The LGA package is now available for all RTAX-S devices offered in ceramic column grid array (CCGA) packaging, including RTAX1000S and RTAX2000S devices. For further information about Actel's advanced ...