Sony is keeping the size down to 8mm diagonal, meaning there won’t be the need for a huge camera bump, though the lens in front of the sensor will of course play a big part in the camera’s ...

In the first half of 2022, Sony plans to launch the IMX459 1/2.9-type (6.25 mm diagonal) stacked SPAD depth sensor for automotive LiDAR applications using direct Time-of-Flight (dToF) method.

The OX05D10 image sensor is ideal for all automotive use cases where high dynamic range (HDR), low-light performance and LFM are critical. It will be showcased at AutoSens Detroit , taking place ...

Toshiba launches "CIPS183BS210", a Contact Image-Sensor Module with a faster data rate, which supports high-speed and high-accuracy banknote recognition applications for Chinese market. Contacts ...