The chip's die size is 18.6 mm 2. The company expects to scale it down to 4 mm 2 with next-generation processes. The SSP1492 sensor-signal-processor chip consists of a standard IC core that ...

"PLDA is the largest provider of IP cores for the logical and transport layers of PCI, PCI-X and PCI Express," according to A Guide to High-Speed Interconnects, published by The Linley Group, Inc.

SAN JOSE, CALIF. –– December 8, 2010 –– Forte Design Systems announced today that Cynthesizer™ high-level synthesis software has been selected for use in Fujitsu Semiconductor Limited’s ...