Latent reactive filaments based on epoxy resin are a promising alternative with comparable mechanical properties. These innovative materials enable processing at lower temperatures and crosslink ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. Image Credit: Master Bond Inc. The system is ...