As noted in a recent blog post, the current HBM4 doubles channel count per stack with a 2Kbit interface, speed bins up to 6.4Gbps, and options supporting 16-high through-silicon via (TSV) stacks.

By using the 1β process node, Micron says that its second-generation HBM3 stack delivers 2.5x more performance for the same amount of power as an HBM2 stack with 50 percent faster data-transfer ...