Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, and managing heat dissipation. As the industry moves toward miniaturization, ...

Understanding chip design as a strategic necessity, the Ministry of Electronics and Information Technology (MeitY), with its ...

The Chips to Startup (C2S) Programme represents a cornerstone of this effort, targeting the development of 85,000 ...

Google plans to work with a new firm to help design and produce some of its artificial intelligence chips: MediaTek. Google ...

March 04, 2025 (GLOBE NEWSWIRE) -- Saras Micro Devices (Saras), an emerging leader in cutting-edge system power performance solutions leveraging integrated packaging design, today announced its ...

Sarcina Technology's AI platform can create advanced AI packaging solutions tailored to meet customised requirements.

Microsystems, a division of izmo, Inc parent - izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive industry partner with IIT Madras in a groundbreaking project at the Centre for ...

Prime Minister Anwar Ibrahim said the agreement with Arm will allow Malaysia to design, manufacture, test and assemble AI chips to be sold ... built around advanced packaging, assembly and ...