Some repairs, though, are in a class by themselves, like this memory module transplant for a digital scopemeter. The story began some time ago when [FeedbackLoop] picked up a small lot of broken ...

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Teledyne’s DDR4 memory module is screened and qualified as an Enhanced Product (EP) for high-reliability aerospace and defense systems.

Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and ...

“With the BGAP520 PCIe NVMe products in Type 1620 BGA package and M.2 2230 module, designers can count on robust and ruggedized Flash memory solutions with unrivalled performance.

Claimed to be the industryÕs smallest and thinnest memory modules, the members of this micro-DIMM product line measure only 1.18" high and have a capacity of 256 MB for both SDR- and DDR-based ...

The resulting 457-pin BGA module has a size of only 12.3mm x 20.3mm x 2.34mm. The MobileStak designs can integrate a variety of chip packages, as well as devices provided as bare die.

The SF-BGA199B-B-05 BGA-socket adapter accepts Samsung’s 0.65-mm pitch, 12 mm x 16 mm body 18X22 array MCP KMYFE0C0CM-D300 memory IC’s.