Early work on 3D NAND followed the same path as that being pursued for stacked logic and non-flash memories, such as magnetic and phase-change RAMs. These build layers of memory elements one at a time ...

Finally, you've got 3D chips like this, in which RAM and CPU are combined in a monolithic structure. All of these are "3D" to one extent or another, so it's important to be careful of what type of ...

3D technology will likely dominate memory and processor developments over the next few years and likely include not just conventional SRAM, DRAM and flash memory but also new memory technologies ...

That’s an aspect ratio (AR) of about 6 to 1. 3D NAND structures already work at an AR of around 60 to 1 and this will continue to increase in coming years. Moreover, as multi-layered stack heights ...

The “3D-ness” of this memory of course refers to the stackability of cell layers. But stacked-die is another 3D approach. Micron’s Hybrid Memory Cube (HMC) uses stacked DRAM die and through-silicon ...

RF devices do not themselves require aggressive scaling, but can still benefit from the shorter circuit paths that 3D integration can provide. Within these in-memory compute and RF integration ...

“High aspect ratio (HAR) structures found in three-dimensional nand memory structures have unique process control challenges. The etch used to fabricate channel holes several microns deep with aspect ...

First commercial 3D NAND products were introduced in 2013 with stacks counting 24 word-line layers (128 Gb). Depending on the supplier, variations in the structure exist, known by different names such ...

Russ Meyer, Micron’s director of process integration, said 3D XPoint chips are in production but they’re awaiting their final form factor according to what equipment manufacturers will need.