Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process further allows ...

Researchers have proposed process flow guides for 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet-engine ...

From Black Box to Full Transparency & Control—Flow Developer Unlocks Print Process Optimization & Enables a Pathway to Migrate AM Knowledge to Velo3D ...

In this video, you’ll witness the full process of creating an eye-catching 3D doodle artwork using only Paint 3D. No ...

SUTD, SUSTech and ZJU researchers' proposed process flow guides 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet ...