Combined with newly developed SMT capacitors and power inductors, the result is advanced multi-channel power management capabilities in a single miniature (11 x 11 x 1.6 mm) package. The major ...

Fig. 2: The 3D SiP module on a flexible substrate connects the conductive electrode to temperature sensor to SiP module to round PCB in this smart earbud. Source: ASE On the flexible printed circuit, ...

Impedance matching is done in the package. To this, the module adds power management, 2kbit of eeprom, the 10/100 Etherney PHY, a 64Mbit QSPI ... He has a particular interest in the Power and Embedded ...

Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on March 29, feature an optimized package structure to reduce switching loss and improve SiC ...

Combining the VCSEL emitter and photodiode in a single 3.3×2.4×1.2-mm package, the Bidos P2433 Q offers one of the smallest VCEL packages on the market for 3D applications at the same power levels and ...

Starting with pre-packaged GaN dies, the project will work through a phased programme to develop the design and manufacturing processes and testing techniques needed to produce compact, modularised ...

SolarEdge Introduces the Latest Generation of PV Module Embedded Power Optimizers, Monitoring and Inverters at Intersolar Europe Intersolar Europe May 20, 2010 05:47 AM Eastern Daylight Time ...

MOUNTAIN VIEW, Calif., – September 23, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, and VisiSonics, a developer of best-in-class, ...